1
|
Layers
|
1-30 layers
|
2
|
Max. Board size
|
2000×610mm
|
3
|
Min. line Width/Space
|
0.075mm(3mil)
|
4
|
Max. Copper thickness
|
6OZ
|
5
|
Min. S/M Pitch
|
0.075mm(3mil)
|
6
|
Min. hole size
|
0.1mm(4mil)
|
7
|
Hole Positon
|
+/-0.075mm(3mil) CNC Driling
|
8
|
Hole dia. Tolerance (NPTH)
|
+0/-0.05mm(2mil)
|
9
|
Insulation Resistance
|
10Kohm-20Mohm
|
10
|
Outline tolerance
|
±0.10mm(4mil)
|
11
|
Twist & Bent
|
0.75%
|
12
|
Insulation Resistance
|
>1012 Ω Normal
|
13
|
Electric strength
|
>1.3kv/mm
|
14
|
S/M abrasion
|
>6H
|
15
|
Surface Finish
|
HASL(LF), Gold plating, Electroless nickel immersion gold,
Immersion Tin, OSP(Entek)
|
16
|
Solder Mask
|
Green/Black/White/Red/Blue/Yellow
|
17
|
Panel Size
|
110×100mm(min);660×600mm(max)
|
18
|
Test Voltage
|
10-300V
|
19
|
Thermal stress
|
288°C 20Sec
|
20
|
Min. blind/buried via
|
0.15mm (6mil)
|
21
|
Surface Finished
|
HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold
|
22
|
Materials
|
FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base
|
