1.650-044 Printed Circuit Board
2.repair printed circuit board
3.Weight :0.5kg
4.ISO9001
5.1 years guarantee.
2.repair printed circuit board
3.Weight :0.5kg
4.ISO9001
5.1 years guarantee.
650-045 Printed Circuit Board
for gensets OLYMPLAN-MASSEY FERGUSON 12V.
The 650-044 Printed Circuit Board for gensets OLYMPLAN-MASSEY FERGUSON 24V.
Ensure the MPU (Magnetic Pickup) is installed correctly.
Unscrew and pull out the magnetic pickup that is located near the flywheel of the engine
Inspect the magnetic tip and ensure that it is clean and free of debris.
Screw the MPU in until the tip makes contact with the top of the flywheel teeth.
Back out the magnetic pickup ½ to ¾ of a turn.
EIM (Engine Interface Module)
Turn the ten-turn potentiometer between five to seven turns clockwise or just until you feel a small click - signifying the full span of the pot.
Start the generator set. You will notice the overspeed calibration LED illuminated.
Slowly turn the potentiometer counter-clockwise until the LED just turns off.
As soon as the LED turns off, start to slowly turn back the potentiometer clockwise just until the led starts to flicker.
We can supply the following products:
PCB 650-044
PCB 650-091,
PCB 650-092.
EIM 630-465,
EIM6 30-466.
pcb transformers
generator accessories
specification about PCB Board 650-044
1
|
Layers
|
1-30 layers
|
2
|
Max. Board size
|
2000×610mm
|
3
|
Min. line Width/Space
|
0.075mm(3mil)
|
4
|
Max. Copper thickness
|
6OZ
|
5
|
Min. S/M Pitch
|
0.075mm(3mil)
|
6
|
Min. hole size
|
0.1mm(4mil)
|
7
|
Hole Positon
|
+/-0.075mm(3mil) CNC Driling
|
8
|
Hole dia. Tolerance (NPTH)
|
+0/-0.05mm(2mil)
|
9
|
Insulation Resistance
|
10Kohm-20Mohm
|
10
|
Outline tolerance
|
±0.10mm(4mil)
|
11
|
Twist & Bent
|
0.75%
|
12
|
Insulation Resistance
|
>1012 Ω Normal
|
13
|
Electric strength
|
>1.3kv/mm
|
14
|
S/M abrasion
|
>6H
|
15
|
Surface Finish
|
HASL(LF), Gold plating, Electroless nickel immersion gold,
Immersion Tin, OSP(Entek)
|
16
|
Solder Mask
|
Green/Black/White/Red/Blue/Yellow
|
17
|
Panel Size
|
110×100mm(min);660×600mm(max)
|
18
|
Test Voltage
|
10-300V
|
19
|
Thermal stress
|
288°C 20Sec
|
20
|
Min. blind/buried via
|
0.15mm (6mil)
|
21
|
Surface Finished
|
HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold
|
22
|
Materials
|
FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base
|
